PCB for Mobile Communication

Features

The PCB used in mobile telephone is a special product that shows a big difference in the manufacturing process from other general-purpose multi-layer printed circuit board (MLB). As the tendency of making information communication equipment lighter, thinner, shorter and smaller seems to deepen further, the buildup process by which it is possible to design the thinnest and hyperfine pattern will be established as the main-force MLB process in the existing MLB processes in future. The number of terminals produced by domestic mobile telephone companies amounts to 1.50 to 1.70 million a month and about 80% of these have buildup boards loaded.

As the mobile telephone market is activated like this, the size of the domestic buildup board market is rapidly growing as well.
Considering the total domestic production of PCB would amount to about 2.5 trillion won, the size of the buildup board market is estimated to reach 500 billion won, which is 80% of the total.
Currently the buildup board is loaded mainly on the mobile telephone, but in future the scope of application will be expanded to include TFT LCD, personal digital assistant (PDA), computer network system and semiconductor package board. By 2003, about 50% of the multilayer printed circuit boards (MLB) produced domestically will be replaced by buildup boards.

Application

Build up PCB : Mobile Phone, PCS, Notebook PC, Camcorder, Bluetooth, PCMCIA

Technical Capability

Process Patent

• Application Number : 10 - 1999 - 028624
• Application Number : 2001 - 50138

Technical Solution