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Cosmotech Co., Ltd.
[Korea]
Address:
#532-1, Yonggang-ri, Jeungpyung-eup, Jeungpyeong-gun, Chungcheongbuk-do 368-903 Korea
Phone:
82-43-8201112
Contact name:
Ji-young Kim , Assistant Manager
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Cosmotech Co., Ltd.
 
Products

PCB for Satellite Broadcast

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PCB for Satellite Broadcast

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Features

Artificial satellites, which can provide a wide range of services, for which it is easy to build network, and which are hardly affected by natural disasters, have a good prospect that they will become a critical element in the next-generation global communication network. The satellite technology that has been recognized as just one of the complementary means for ground network is building independent and advanced communication broadcasting systems.

After launching satellites Uribyeol 1 and 2 for scientific and technological experiments respectively in August 1992 and September the next year to become one of the satellite-owning countries, we shot satellites Mugunghwa Nos. 1~3 up into space beginning with 1995.

Until recently, about 5,000 artificial satellites have been launched worldwide, of which over 2,400 satellites are in operation. If satellite broadcasting and global mobile personal communication service (GMPCS) are commercialized, the number of satellites is expected to increase.
It is estimated that the spread effect of satellite service on domestic industry will reach 3,528.4 billion won in 2001, 10,931.9 billion won in 2003 and about 30 trillion won in 2005. Consequently, with satellite broadcasting, digital data transmission and the popularization of digital AV service approaching, it is foreseen that the markets for satellite communication terminal, satellite broadcasting receiver (SVR), satellite receiving card for PC, high-frequency circuit (RF) parts and satellite antenna, cable TV equipment and LNB will be greatly expanded.

Application

Teflon : LNB, LNA, GPS, Antenna

Technical Capability

Base Material
PTFE, PTFE + FR4, PTFE + Metal
Thickness
0.5~3.2mm
Conductor Line/Space
0.10/0.10mm
Hole Diameter
0.2mm
Surface Treatment
Soft& Hard Gold Plating, Immersion Tin, Hasl

Process Patent

Application Number : 10 - 1999 - 001849

Technical Solution


Related Keywords: PCB , mlb , teflon , ss , ds , module


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