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Cosmotech Co., Ltd.
[Korea]
Address:
#532-1, Yonggang-ri, Jeungpyung-eup, Jeungpyeong-gun, Chungcheongbuk-do 368-903 Korea
Phone:
82-43-8201112
Contact name:
Ji-young Kim , Assistant Manager
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Cosmotech Co., Ltd.
 
Products

PCB for Semiconductor

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PCB for Semiconductor

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Features

The accelerated digitalization of communication and electric home appliances and the sharp decrease in demand for PC require diversification of the semiconductor product line. Unlike the computer that used to process characters, numbers and two-dimensional images, the portable communication terminals and digital home appliances process audio and video data. As a result of this, adoption of the mass storage system in these products is increasing and the market is also growing fast.

If the 1990s is the age of computer, the 2000s is the age of communication and digital home appliances. For this reason, the demand for memory semiconductor is moving gradually from computer and peripheral equipment toward communication and digital home appliances. So far, the scope of application of semiconductor is limited to workstation, PC, printerand related peripheral equipment. But with the development of digital technology, the scope of its application in the 21st century tends to expand rapidly to portable communication terminals, digital TV and digital video disk (DVD), digital camera and camcorder and game player. And with the actualization of IMT2000 and digital broadcasting, the semiconductor is estimated to reach a high growth of more than 15% annually.

The size of the semiconductor market in 2000 was 228 billion dollars and it is estimated to reach 340 billion dollars in 2001. And the demand for PCs and communication equipment and home appliances loaded with the semiconductor will exceed 3.5 trillion dollars and consequently the PCB market is expected to make a high growth as well.

Application

  • Module : Dram, SDRam, Rambus, DDR, PLL, PAM
  • Package : BGA, CSP, FILP-CHIP, MCM

Technical Capability

Base Material
FR-4, Polyimide
Thickness
0.2~1.27mm
Conductor Line/Space
0.05/0.05mm
Hole Diameter
Bit 0.2mm, Laser 0.1mm
Surface Treatment
Soft& Hard Gold Plating, Immersion Tin, Hasl, Pre-Flux

Process Patent

Application Number : 2000 - 5632

Technical Solution


Related Keywords: Build-Up


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